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Proceedings Paper

EB defect inspection of EUV resist patterned wafer for hp 32 nm and beyond
Author(s): Mari Nozoe; Toshihiko Tanaka; Takashi Kamo; Shinji Kubo; Tomohiro Tamori; Noriaki Takagi; Takeshi Yamane; Tsuneo Terasawa; Hiroyuki Shigemura; Osamu Suga
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Paper Abstract

It is important to control the defect level of the EUV lithography mask because of pellicle-less. We studied the resist patterned wafer inspection method using EB inspection system. In this paper, the defect detection sensitivity of EB inspection system is quantified using hp 32 nm line and space pattern with about 5 nm LWR (Line Width Roughness). Programmed defects of 13 nm narrowing and 10 nm widening have been detected successfully after the optimization of column and inspection condition. Next, the defects detected by mask inspection system and EB wafer inspection system were compared and were in good agreement for printed killer defects. In these results, EB inspection system is proved to be useful for EUV resist inspection. Further, we evaluated the resist material damage by EB inspection irradiation and indicated the direction of reducing the shrinkage.

Paper Details

Date Published: 20 April 2011
PDF: 12 pages
Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 797123 (20 April 2011); doi: 10.1117/12.879346
Show Author Affiliations
Mari Nozoe, Semiconductor Leading Edge Technologies, Inc. (Japan)
Toshihiko Tanaka, Semiconductor Leading Edge Technologies, Inc. (Japan)
Takashi Kamo, Semiconductor Leading Edge Technologies, Inc. (Japan)
Shinji Kubo, Semiconductor Leading Edge Technologies, Inc. (Japan)
Tomohiro Tamori, Semiconductor Leading Edge Technologies, Inc. (Japan)
Noriaki Takagi, Semiconductor Leading Edge Technologies, Inc. (Japan)
Takeshi Yamane, Semiconductor Leading Edge Technologies, Inc. (Japan)
Tsuneo Terasawa, Semiconductor Leading Edge Technologies, Inc. (Japan)
Hiroyuki Shigemura, Semiconductor Leading Edge Technologies, Inc. (Japan)
Osamu Suga, Semiconductor Leading Edge Technologies, Inc. (Japan)


Published in SPIE Proceedings Vol. 7971:
Metrology, Inspection, and Process Control for Microlithography XXV
Christopher J. Raymond, Editor(s)

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