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Proceedings Paper

Resist dispense system for further defect reduction
Author(s): Yusuke Yamamoto; Kouzo Nishi; Koji Takayanagi; Takahiro Okubo; Toshinobu Furusho; Kosuke Yoshihara; Tsuyoshi Shibata
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Paper Abstract

As pattern size becomes smaller, requirement for defect reduction is getting higher and higher. It is known that defects occur in various steps of lithography process. In this study, we focus on defects related to the resist dispense system. Of those defects, the most typical is bridge type defect which caused by foreign substances contained in resist film. The source of those is considered to be insoluble substances, such as resist gels, in resist liquid. So far, the conventional countermeasure has been the development of resist line filters (optimization of materials, shrinking of pore size, and so on). But, according to the recent reports and our experimental result, we can say that not only filter type but also filtration condition has certain influence on bridge type defect generation. In this study, we examine the influences of resist dispense system and its parameters on bridge type defect generation. This paper provides some experimental data and introduces our approaches to the optimization of resist dispense system and its effects.

Paper Details

Date Published: 15 April 2011
PDF: 8 pages
Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 797230 (15 April 2011); doi: 10.1117/12.879339
Show Author Affiliations
Yusuke Yamamoto, Tokyo Electron Kyushu Ltd. (Japan)
Kouzo Nishi, Tokyo Electron Kyushu Ltd. (Japan)
Koji Takayanagi, Tokyo Electron Kyushu Ltd. (Japan)
Takahiro Okubo, Tokyo Electron Kyushu Ltd. (Japan)
Toshinobu Furusho, Tokyo Electron Kyushu Ltd. (Japan)
Kosuke Yoshihara, Tokyo Electron Kyushu Ltd. (Japan)
Tsuyoshi Shibata, Tokyo Electron Kyushu Ltd. (Japan)

Published in SPIE Proceedings Vol. 7972:
Advances in Resist Materials and Processing Technology XXVIII
Robert D. Allen; Mark H. Somervell, Editor(s)

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