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Proceedings Paper

Patterning conventional photoresists in environmentally friendly silicone fluids
Author(s): Christine Y. Ouyang; Jin-Kyun Lee; Marie Krysak; Christopher K. Ober
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Paper Abstract

The chemical waste generated in today's microelectronic fabrication process can be released into the environment and cause environmental and health concerns. It is therefore necessary to develop an environmentally friendly process that can eliminate the use of toxic chemical solvents. Silicone fluids are linear methyl siloxanes that only contain carbon, hydrogen, oxygen and silicon. They are low in toxicity, not ozone-depleting and contribute little to global warming. They degrade into naturally occurring compounds instead of accumulating in the atmosphere and can be recycled. Their unique physical and chemical properties have also made them promising developers for lithography. For example, their low surface tension can eliminate pattern collapse problems associated with high aspect-ratio features. Silicone fluids are non-polar solvents and their solvent strength is weaker than that of saturated hydrocarbons but stronger than that of the commercially available saturated hydrofluorocarbons and may be enhanced by adding other solvents. Two conventional photoresists used in this study, PBOCST and ESCAP are both insoluble in silicone fluids before or after exposure. However, the solubility of PBOCST and ESCAP in silicone fluids can be increased by using a silicon-containing additive. In this paper, we demonstrate this novel and environmentally friendly development of conventional photoresists in silicone fluids.

Paper Details

Date Published: 15 April 2011
PDF: 6 pages
Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 79720O (15 April 2011); doi: 10.1117/12.879294
Show Author Affiliations
Christine Y. Ouyang, Cornell Univ. (United States)
Jin-Kyun Lee, Cornell Univ. (United States)
Marie Krysak, Cornell Univ. (United States)
Christopher K. Ober, Cornell Univ. (United States)


Published in SPIE Proceedings Vol. 7972:
Advances in Resist Materials and Processing Technology XXVIII
Robert D. Allen; Mark H. Somervell, Editor(s)

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