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Proceedings Paper

The effect of ambient conditions on thin wafers processed with fs-laser machining
Author(s): Sae Chae Jeoung
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Paper Abstract

Yield stress of 80 μm thick glass wafer chip diced with fs-laser μ-processing was investigated with varying the repetition rate of laser pulse and scanning speed under constant number of shot. By using constant laser fluence, the yield stress is almost invariant at lower repetition rate less than 20 kHz, but abruptly drops to the half of initial yield stress. Based on the effect of the ambient gas on the transition point of yield stress changes, we propose an empirical relation between the yield stress and cumulative stress caused by temperature increment with changing the laser repetition rate.

Paper Details

Date Published: 11 February 2011
PDF: 7 pages
Proc. SPIE 7925, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XI, 792514 (11 February 2011); doi: 10.1117/12.878818
Show Author Affiliations
Sae Chae Jeoung, Korea Research Institute of Standards and Science (Korea, Republic of)


Published in SPIE Proceedings Vol. 7925:
Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XI
Alexander Heisterkamp; Joseph Neev; Stefan Nolte, Editor(s)

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