Share Email Print
cover

Proceedings Paper

Self-aligned double-patterning (SADP) friendly detailed routing
Author(s): Minoo Mirsaeedi; J. Andres Torres; Mohab Anis
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Amongst the possible double patterning strategies for sub 32nm processes, self-aligned double patterning (SADP) has moved from Flash-only processes to more general purpose devices. The reason is that while litho-etch- litho-etc (LELE) process was originally preferred due to its simplicity and relative low cost, its sensitivity to overlay error has prompted the search for other methods. Although the basic SADP process is fairly robust against the overlay error, the robustness of 2D SADP method strongly depends on layout and decomposition styles and decomposability compliance. In this paper, we first discuss different printability challenges for SADP method. Afterward, we propose a SADP-aware detailed routing method, by applying a correct-by-construction approach, to provide SADP-friendly layouts. This method performs detailed routing and layout decomposition concurrently to prevent litho-limited layout configurations. Experimental results show that, compared with a SADP-blind detailed router, the proposed method achieves considerable robustness against lithography imperfection in expense of tolerable wire length overhead.

Paper Details

Date Published: 4 April 2011
PDF: 9 pages
Proc. SPIE 7974, Design for Manufacturability through Design-Process Integration V, 79740O (4 April 2011); doi: 10.1117/12.877601
Show Author Affiliations
Minoo Mirsaeedi, Univ. of Waterloo (Canada)
J. Andres Torres, Mentor Graphics Corp. (United States)
Mohab Anis, The American Univ. in Cairo (Egypt)


Published in SPIE Proceedings Vol. 7974:
Design for Manufacturability through Design-Process Integration V
Michael L. Rieger, Editor(s)

© SPIE. Terms of Use
Back to Top