Share Email Print
cover

Proceedings Paper

Atomic layer deposition/molecular layer deposition for packaging and interconnect of N/MEMS
Author(s): Y. C. Lee
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Atomic layer deposition (ALD)/molecular layer deposition (MLD) processes are able to fabricate nano-scaled inorganic/organic multilayers. Such multilayers are essential to novel packaging and interconnect technologies for NEMS/MEMS. ALD/MLD coatings could reduce water vapor transmission rate down to 5X10-5 g/m2/day or lower for excellent hermetic/vacuum sealing. ALD/MLD coatings can also modify nanowire/nanomesh structures critical to flexible thermal ground planes that can reach an effective thermal conductivity of 30,000 W/mK and heat flux removal of 200 W/cm2. ALD/MLD coatings can enhance the stability while reducing thickness of an embedded Li-ion battery. In addition, the ALD/MLD-based inorganic/organic multilayer can be used for interconnecting nanowire-based photonics.

Paper Details

Date Published: 11 February 2011
PDF: 9 pages
Proc. SPIE 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X, 792802 (11 February 2011); doi: 10.1117/12.877110
Show Author Affiliations
Y. C. Lee, Univ. of Colorado at Boulder (United States)


Published in SPIE Proceedings Vol. 7928:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
Sonia Garcia-Blanco; Rajeshuni Ramesham, Editor(s)

© SPIE. Terms of Use
Back to Top