Share Email Print

Proceedings Paper

Silicon TSV interposers for photonics and VLSI packaging
Author(s): N. Vodrahalli; C. Y. Li; V. Kosenko
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Miniaturization, higher performance, and higher bandwidth needs of the electronic industry continue to drive technology innovations through increased levels of integration. Through Silicon Via (TSV) technology along with flip chip technology provides significant improvements over the traditional technologies for packaging VLSI circuits. Silicon Interposers built using TSVs and embedded capacitors provide solutions to the next generation needs of VLSI Packaging. TSV Si interposers also provide a paltform for integrating photonic elements like the laser diodes and optical fibers for next generation high bandwidth VLSI packaging. The presentation describes (i) the TSV technologies developed, (ii) implementation of Si TSV interposer with embedded capacitors for VLSI packaging, and (iii) development of Si TSV interposer for integration of photonics and VLSI subsystems. Reliability results of interposers with embedded capacitors are also presented.

Paper Details

Date Published: 2 March 2011
PDF: 7 pages
Proc. SPIE 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X, 792806 (2 March 2011); doi: 10.1117/12.876877
Show Author Affiliations
N. Vodrahalli, ALLVIA, Inc. (United States)
C. Y. Li, ALLVIA, Inc. (United States)
V. Kosenko, ALLVIA, Inc. (United States)

Published in SPIE Proceedings Vol. 7928:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
Sonia Garcia-Blanco; Rajeshuni Ramesham, Editor(s)

© SPIE. Terms of Use
Back to Top