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Proceedings Paper

Revolutionary innovation in system interconnection: a new era for the IC
Author(s): Muhannad S. Bakir; Paragkumar A. Thadesar; Calvin King; Jesal Zaveri; Hyung Suk Yang; Chaoqi Zhang; Yue Zhang
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Paper Abstract

This paper describes novel microscale electrical, optical, and fluidic interconnect networks to address off-chip interconnect challenges in high-performance computing systems as well as to enable 3D heterogeneous integration of CMOS and MEMS/sensors.

Paper Details

Date Published: 11 February 2011
PDF: 8 pages
Proc. SPIE 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X, 792803 (11 February 2011); doi: 10.1117/12.876823
Show Author Affiliations
Muhannad S. Bakir, Georgia Institute of Technology (United States)
Paragkumar A. Thadesar, Georgia Institute of Technology (United States)
Calvin King, Georgia Institute of Technology (United States)
Jesal Zaveri, Georgia Institute of Technology (United States)
Hyung Suk Yang, Georgia Institute of Technology (United States)
Chaoqi Zhang, Georgia Institute of Technology (United States)
Yue Zhang, Georgia Institute of Technology (United States)


Published in SPIE Proceedings Vol. 7928:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
Sonia Garcia-Blanco; Rajeshuni Ramesham, Editor(s)

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