Share Email Print
cover

Proceedings Paper

Hybrid-integrated silicon photonic bridge chips for ultralow-energy inter-chip communications
Author(s): Hiren D. Thacker; Ivan Shubin; Ying Luo; Joannes Costa; Jon Lexau; Xuezhe Zheng; Guoliang Li; Jin Yao; Dinesh Patil; Frankie Liu; Ron Ho; Thierry Pinguet; Po Dong; Dazeng Feng; Mehdi Asghari; Kannan Raj; James G. Mitchell; Ashok V. Krishnamoorthy; John E. Cunningham
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We present a hybrid integration technology platform for the compact integration of best-in-breed VLSI and photonic circuits. This hybridization solution requires fabrication of ultralow parasitic chip-to-chip interconnects on the candidate chips and assembly of these by a highly accurate flip-chip bonding process. The former is achieved by microsolder bump interconnects that can be fabricated by wafer-scale processes, and are shown to have average resistance <1 ohm/bump and capacitance <25fF/bump. This suite of technologies was successfully used to hybrid integrate high speed VLSI chips built on the 90nm bulk CMOS technology node with silicon photonic modulators and detectors built on a 130nm CMOS-photonic platform and an SOI-photonic platform; these particular hybrids yielded Tx and Rx components with energies as low as 320fJ/bit and 690fJ/bit, respectively. We also report on challenges and ongoing efforts to fabricate microsolder bump interconnects on next-generation 40nm VLSI CMOS chips.

Paper Details

Date Published: 17 January 2011
PDF: 11 pages
Proc. SPIE 7944, Optoelectronic Interconnects and Component Integration XI, 79440B (17 January 2011); doi: 10.1117/12.876526
Show Author Affiliations
Hiren D. Thacker, Oracle (United States)
Ivan Shubin, Oracle (United States)
Ying Luo, Oracle (United States)
Joannes Costa, Oracle (United States)
Jon Lexau, Oracle (United States)
Xuezhe Zheng, Oracle (United States)
Guoliang Li, Oracle (United States)
Jin Yao, Oracle (United States)
Dinesh Patil, Oracle (United States)
Frankie Liu, Oracle (United States)
Ron Ho, Oracle (United States)
Thierry Pinguet, Luxtera (United States)
Po Dong, Kotura, Inc. (United States)
Dazeng Feng, Kotura, Inc. (United States)
Mehdi Asghari, Kotura, Inc. (United States)
Kannan Raj, Oracle (United States)
James G. Mitchell, Oracle (United States)
Ashok V. Krishnamoorthy, Oracle (United States)
John E. Cunningham, Oracle (United States)


Published in SPIE Proceedings Vol. 7944:
Optoelectronic Interconnects and Component Integration XI
Alexei L. Glebov; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top