Share Email Print
cover

Proceedings Paper

Low-power photonic components for optical interconnects
Author(s): Po Dong; Shirong Liao; Hong Liang; Ning-Ning Feng; Wei Qian; Roshanak Shafiiha; Dazeng Feng; Guoliang Li; Xuezhe Zheng; John E. Cunningham; Ashok V. Krishnamoorthy; Mehdi Asghari
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Silicon-based optical interconnects are expected to provide high bandwidth and low power consumption solutions for chip-level communication applications, due to their electronics integration capability, proven manufacturing record and attractive price volume curve. In order to compete with electrical interconnects, the energy requirement is projected to be sub-pJ per bit for an optical link in chip to chip communication. Such low energies pose significant challenges for the optical components used in these applications. In this paper, we review several low power photonic components developed at Kotura for DARPA's Ultraperformance Nanophotonic Intrachip Communications (UNIC) project. These components include high speed silicon microring modulators, wavelength (de)multiplexers using silicon cascaded microrings, low power electro-optic silicon switches, low loss silicon routing waveguides, and low capacitance germanium photodetectors. Our microring modulators demonstrate an energy consumption of ~ 10 fJ per bit with a drive voltage of 1 V. Silicon routing waveguides have a propagation loss of < 0.3 dB/cm, enabling a propagation length of a few tens of centimeters. The germanium photodetectors can have a low device capacitance of a few fF, a high responsivity up to 1.1 A/W and a high speed of >30 GHz. These components are potentially sufficient to construct a full optical link with an energy consumption of less than 1 pJ per bit.

Paper Details

Date Published: 18 January 2011
PDF: 8 pages
Proc. SPIE 7944, Optoelectronic Interconnects and Component Integration XI, 794403 (18 January 2011); doi: 10.1117/12.876425
Show Author Affiliations
Po Dong, Kotura, Inc. (United States)
Shirong Liao, Kotura, Inc. (United States)
Hong Liang, Kotura, Inc. (United States)
Ning-Ning Feng, Kotura, Inc. (United States)
Wei Qian, Kotura, Inc. (United States)
Roshanak Shafiiha, Kotura, Inc. (United States)
Dazeng Feng, Kotura, Inc. (United States)
Guoliang Li, Oracle (United States)
Xuezhe Zheng, Oracle (United States)
John E. Cunningham, Oracle (United States)
Ashok V. Krishnamoorthy, Oracle (United States)
Mehdi Asghari, Kotura, Inc. (United States)


Published in SPIE Proceedings Vol. 7944:
Optoelectronic Interconnects and Component Integration XI
Alexei L. Glebov; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top