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Proceedings Paper

Novel applications of sub-surface laser machining
Author(s): B. R. Campbell; L. A. Forster; D. M. Bernot
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Paper Abstract

Lasers can uniquely be used to create physical changes inside a bulk material. Traditional manufacturing processes are limited to surface modifications, but a laser can be focused at any location inside a material transparent to that wavelength. Using sub surface machining methods with ultrashort pulse lasers two practical applications are demonstrated. First, a laser is used to sever short-circuited wires embedded deep inside a thick piece of glass, effectively repairing a defective wire network. Second, subsurface bar-coding was shown to produce readable markings. Surface laser markings were shown to weaken the glass, but subsurface marking had virtually no effect on strength.

Paper Details

Date Published: 21 February 2011
PDF: 12 pages
Proc. SPIE 7920, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVI, 79200T (21 February 2011); doi: 10.1117/12.876050
Show Author Affiliations
B. R. Campbell, The Pennsylvania State Univ. Electro-Optics Ctr. (United States)
L. A. Forster, The Pennsylvania State Univ. Electro-Optics Ctr. (United States)
D. M. Bernot, The Pennsylvania State Univ. Electro-Optics Ctr. (United States)


Published in SPIE Proceedings Vol. 7920:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVI
Bo Gu; Guido Hennig; Xianfan Xu; Hiroyuki Niino, Editor(s)

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