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Proceedings Paper

Testing of active heat sink for advanced high-power laser diodes
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Paper Abstract

We report on the development of a novel active heat sink for high-power laser diodes offering unparalleled capacity in high-heat flux handling and temperature control. The heat sink employs convective heat transfer by a liquid metal flowing at high speed inside a miniature sealed flow loop. Liquid metal flow in the loop is maintained electromagnetically without any moving parts. Thermal conductance of the heat sink is electronically adjustable, allowing for precise control of diode temperature and the laser light wavelength. This paper presents the principles and challenges of liquid metal cooling, and data from testing at high heat flux and high heat loads.

Paper Details

Date Published: 21 February 2011
PDF: 6 pages
Proc. SPIE 7918, High-Power Diode Laser Technology and Applications IX, 79180G (21 February 2011); doi: 10.1117/12.875979
Show Author Affiliations
John Vetrovec, Aqwest, LLC (United States)
Drew A. Copeland, Aqwest, LLC (United States)
Ryan Feeler, Northrop Grumman Cutting Edge Optronics (United States)
Jeremy Junghans, Northrop Grumman Cutting Edge Optronics (United States)

Published in SPIE Proceedings Vol. 7918:
High-Power Diode Laser Technology and Applications IX
Mark S. Zediker, Editor(s)

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