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Proceedings Paper

Packaging technology enabling flexible optical interconnections
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Paper Abstract

This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure.

Paper Details

Date Published: 18 January 2011
PDF: 9 pages
Proc. SPIE 7944, Optoelectronic Interconnects and Component Integration XI, 79440E (18 January 2011); doi: 10.1117/12.874959
Show Author Affiliations
Erwin Bosman, Univ. Gent (Belgium)
Geert Van Steenberge, Univ. Gent (Belgium)
Jeroen Missinne, Univ. Gent (Belgium)
Bram Van Hoe, Univ. Gent (Belgium)
Sandeep Kalathimekkad, Univ. Gent (Belgium)
Peter Van Daele, Univ. Gent (Belgium)


Published in SPIE Proceedings Vol. 7944:
Optoelectronic Interconnects and Component Integration XI
Alexei L. Glebov; Ray T. Chen, Editor(s)

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