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Proceedings Paper

CO2 laser scribe of chemically strengthened glass with high surface compressive stress
Author(s): Xinghua Li; Butchi R. Vaddi
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Paper Abstract

Chemically strengthened glass is finding increasing use in handheld, IT and TV cover glass applications. Chemically strengthened glass, particularly with high (>600MPa) compressive stress (CS) and deeper depth of layer (DOL), enable to retain higher strength after damage than non-strengthened glass when its surface is abraded. Corning Gorilla® Glass has particularly proven to be advantageous over competition in this attribute. However, due to high compressive stress (CS) and Central Tension (CT) cutting ion-exchanged glass is extremely difficult and often unmanageable where ever the applications require dicing the chemically strengthened mother glass into smaller parts. We at Corning have developed a CO2 laser scribe and break method (LSB) to separate a single chemically strengthened glass sheet into plurality of devices. Furthermore, CO2 laser scribe and break method enables debris-free separation of glass with high edge strength due to its mirror-like edge finish. We have investigated laser scribe and break of chemically strengthened glass with surface compressive stress greater than 600 MPa. In this paper we present the results of CO2 scribe and break method and underlying laser scribing mechanisms. We demonstrated cross-scribe repetitively on GEN 2 size chemically strengthened glass substrates. Specimens for edge strength measurements of different thickness and CS/DOL glass were prepared using the laser scribe and break technique. The specimens were tested using the standard 4-point bend method and the results are presented.

Paper Details

Date Published: 21 February 2011
PDF: 4 pages
Proc. SPIE 7920, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVI, 79200U (21 February 2011); doi: 10.1117/12.874925
Show Author Affiliations
Xinghua Li, Corning Inc. (United States)
Butchi R. Vaddi, Corning Inc. (United States)


Published in SPIE Proceedings Vol. 7920:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVI
Bo Gu; Guido Hennig; Xianfan Xu; Hiroyuki Niino, Editor(s)

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