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Proceedings Paper

Sub-micron texturing of silicon wafer with fiber laser
Author(s): Hamid Farrokhi; Wei Zhou; Hong Yu Zheng; Zhongli Li
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Paper Abstract

Laser texturing is extensively investigated for modifying surface properties. A continuous wave (CW) fiber laser (λ= 1090nm) was used to pattern a silicon wafer surface in ambient and O2 atmosphere respectively. The O2 gas stream was delivered through a coaxial nozzle to the laser spot. Characterization of the patterned features was carried out by surface profiling, scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDS or EDX), Raman spectroscopy, and X-ray photoelectron spectroscopy (XPS). Formation of laser-induced silicon oxide sub-micron bumps was observed, which were analyzed and shown to cause changes in surface wetability and reflectivity.

Paper Details

Date Published: 11 February 2011
PDF: 12 pages
Proc. SPIE 7926, Micromachining and Microfabrication Process Technology XVI, 792607 (11 February 2011); doi: 10.1117/12.874919
Show Author Affiliations
Hamid Farrokhi, Nanyang Technological Univ. (Singapore)
Wei Zhou, Nanyang Technological Univ. (Singapore)
Hong Yu Zheng, Singapore Institute of Manufacturing Technology (Singapore)
Zhongli Li, Singapore Institute of Manufacturing Technology (Singapore)


Published in SPIE Proceedings Vol. 7926:
Micromachining and Microfabrication Process Technology XVI
Mary Ann Maher; Jung-Chih Chiao; Paul J. Resnick, Editor(s)

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