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Proceedings Paper

GaAs-SOI integration as a path to low-cost optical interconnects
Author(s): Timo Aalto; Mikko Harjanne; Markku Kapulainen; Sami Ylinen; Mircea Guina; Kimmo Haring; Janne Puustinen; Vladimir Mikhrin
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Paper Abstract

We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 μm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode).

Paper Details

Date Published: 27 January 2011
PDF: 8 pages
Proc. SPIE 7941, Integrated Optics: Devices, Materials, and Technologies XV, 79410S (27 January 2011); doi: 10.1117/12.874644
Show Author Affiliations
Timo Aalto, VTT Technical Research Ctr. of Finland (Finland)
Mikko Harjanne, VTT Technical Research Ctr. of Finland (Finland)
Markku Kapulainen, VTT Technical Research Ctr. of Finland (Finland)
Sami Ylinen, VTT Technical Research Ctr. of Finland (Finland)
Mircea Guina, Tampere Univ. of Technology (Finland)
Kimmo Haring, Tampere Univ. of Technology (Finland)
Janne Puustinen, Tampere Univ. of Technology (Finland)
Vladimir Mikhrin, Innolume GmbH (Germany)


Published in SPIE Proceedings Vol. 7941:
Integrated Optics: Devices, Materials, and Technologies XV
Jean Emmanuel Broquin; Gualtiero Nunzi Conti, Editor(s)

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