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Proceedings Paper

Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level
Author(s): Lars Brusberg; Günter Lang; Henning Schröder
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Paper Abstract

The proposed novel packaging approach merges micro-system packaging and glass integrated optics. It provides 3D optical single-mode intra system links to bridge the gap between novel photonic integrated circuits and the glass fibers for inter system interconnects. We introduce our hybrid 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip links. Optical mirrors and lenses provide optical mode matching for photonic IC assemblies and optical fiber interconnects. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties as reviewed in the paper. That makes it perfect for micro-system packaging. The adopted planar waveguide process based on ion-exchange technology is capable for high-volume manufacturing. This ion-exchange process and the optical propagation are described in detail for thin glass substrates. An extensive characterization of all basic circuit elements like straight and curved waveguides, couplers and crosses proves the low attenuation of the optical circuit elements.

Paper Details

Date Published: 17 January 2011
PDF: 12 pages
Proc. SPIE 7944, Optoelectronic Interconnects and Component Integration XI, 79440C (17 January 2011); doi: 10.1117/12.874508
Show Author Affiliations
Lars Brusberg, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Günter Lang, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)

Published in SPIE Proceedings Vol. 7944:
Optoelectronic Interconnects and Component Integration XI
Alexei L. Glebov; Ray T. Chen, Editor(s)

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