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Proceedings Paper

Etching of enamel for direct bonding with a thulium fiber laser
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Paper Abstract

Background: Laser etching of enamel for direct bonding can decrease the risk of surface enamel loss and demineralization which are the adverse effects of acid etching technique. However, in excess of +5.5°C can cause irreversible pulpal responses. In this study, a 1940- nm Thulium Fiber Laser in CW mode was used for laser etching. Aim: Determination of the suitable Laser parameters of enamel surface etching for direct bonding of ceramic brackets and keeping that intrapulpal temperature changes below the threshold value. Material and Method: Polycrystalline ceramic orthodontic brackets were bonded on bovine teeth by using 2 different kinds of etching techniques: Acid and Laser Etching. In addition to these 3 etched groups, there was also a group which was bonded without etching. Brackets were debonded with a material testing machine. Breaking time and the load at the breaking point were measured. Intrapulpal temperature changes were recorded by a K-type Thermocouple. For all laser groups, intrapulpal temperature rise was below the threshold value of 5.5°C. Results and Conclusion: Acid-etched group ( 11.73 MPa) significantly required more debonding force than 3- second- irradiated ( 5.03 MPa) and non-etched groups ( 3.4 MPa) but the results of acid etched group and 4- second- irradiated group (7.5 MPa) showed no significant difference. Moreover, 4- second irradiated group was over the minimum acceptable value for clinical use. Also, 3- second lasing caused a significant reduction in time according to acid-etch group. As a result, 1940- nm laser irradiation is a promising method for laser etching.

Paper Details

Date Published: 18 February 2011
PDF: 6 pages
Proc. SPIE 7884, Lasers in Dentistry XVII, 78840K (18 February 2011); doi: 10.1117/12.874210
Show Author Affiliations
Ayşe S. Kabaş Sarp, Bogaziçi Univ. (Turkey)
Murat Gülsoy, Bogaziçi Univ. (Turkey)


Published in SPIE Proceedings Vol. 7884:
Lasers in Dentistry XVII
Peter Rechmann; Daniel Fried, Editor(s)

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