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Proceedings Paper

Influence of Tm:YAP laser irradiation on tensile strength for bracket debonding
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Paper Abstract

The investigation of tensile strength needed for bracket debonding was the aim of study. A diode pumped Tm: YAP microchip laser generating a continuous 2um radiation with the maximum output power of 4W was used for debonding purposes. The group of 60 brackets was debonded using classical and laser irradiation methods - the doze from 1W to 4 W, 60s. The tensile strength without laser irradiation was in the range from 39.6 N (full ceramic bracket group) to 63.7 N (ceramic bracket with metal slot group). After irradiation the tensile strength was decreased from 35.1 N (full ceramic bracket group) to 48.8 N (ceramic bracket with metal slot group). The results of our study generally agree with the previous studies, substantiating the fact that lasers can be used effectively to thermally soften the adhesive resin for removal of ceramic brackets. From the practical point of view is conclusion that during laser irradiation, thermal ablation occurs and the bracket is removed from the enamel together with the rest of the adhesive resin. Laser debonding is easier and little heat diffusion occurred.

Paper Details

Date Published: 18 February 2011
PDF: 6 pages
Proc. SPIE 7884, Lasers in Dentistry XVII, 788404 (18 February 2011); doi: 10.1117/12.873745
Show Author Affiliations
Tatjana Dostalova, Charles Univ. in Prague (Czech Republic)
Helena Jelinkova, Czech Technical Univ. in Prague (Czech Republic)
Jan Sulc, Czech Technical Univ. in Prague (Czech Republic)
Petr Koranda, Czech Technical Univ. in Prague (Czech Republic)
Michal Nemec, Czech Technical Univ. in Prague (Czech Republic)
Martin Fibrich, Czech Technical Univ. in Prague (Czech Republic)
Michal Jelinek, Czech Technical Univ. in Prague (Czech Republic)
Pavel Michalik, Charles Univ. in Prague (Czech Republic)
Mitsunobu Miyagi, Sendai National College of Technology (Japan)


Published in SPIE Proceedings Vol. 7884:
Lasers in Dentistry XVII
Peter Rechmann; Daniel Fried, Editor(s)

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