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Proceedings Paper

Highly efficient diffractive beam splitters surface-structured on submicron scale using deep-UV laser interference lithography
Author(s): Jun Amako; Daisuke Sawaki; Eiichi Fujii
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Paper Abstract

Highly efficient diffractive beam splitters surface-structured on submicron scale are presented. Submicron relief structures formed on the surfaces of a splitter work as an anti-reflective layer to improve the beam-splitting efficiency. Surface structuring is conducted using deep-UV, liquid-immersion interference lithography and dry etching. Rigorously designed structures with a period of 140 nm and a depth of 55 nm are lithographed onto fused-silica splitters. Splitting efficiencies at 266 nm are increased by 8% to agree favorably with a theoretical value, while Fresnel reflections are substantially reduced. Surface-structured beam splitters reported here are of great use in industrial machining applications using high-power pulsed lasers.

Paper Details

Date Published: 21 February 2011
PDF: 8 pages
Proc. SPIE 7921, Laser-based Micro- and Nanopackaging and Assembly V, 79210N (21 February 2011); doi: 10.1117/12.871859
Show Author Affiliations
Jun Amako, Seiko Epson Corp. (Japan)
Daisuke Sawaki, Seiko Epson Corp. (Japan)
Eiichi Fujii, Seiko Epson Corp. (Japan)


Published in SPIE Proceedings Vol. 7921:
Laser-based Micro- and Nanopackaging and Assembly V
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio, Editor(s)

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