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Proceedings Paper

Crack growth and reliability modeling of multi-layer capacitors in microelectronics applications
Author(s): Gilad Sharon; Donald Barker
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Paper Abstract

Factors affecting the reliability of the ceramic dielectric body of multi layer ceramic capacitors (MLCCs) were explored for several capacitor sizes. Preliminary results indicate a correlation between the materials used for capacitor termination and the emergence of cracks. The authors varied the termination material, shape, and thickness of MLCCs. Under regimes in which boards were subjected to cyclic bending, vibrations, temperature cycling, and high-g loading, cracks have tended to appear on the bottom of the capacitor in proximity to the termination. Flexible termination materials corresponded to reduced crack formation at low strain rates.

Paper Details

Date Published: 18 February 2011
PDF: 9 pages
Proc. SPIE 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X, 79280D (18 February 2011); doi: 10.1117/12.871536
Show Author Affiliations
Gilad Sharon, Univ. of Maryland, College Park (United States)
Donald Barker, Univ. of Maryland, College Park (United States)


Published in SPIE Proceedings Vol. 7928:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
Sonia Garcia-Blanco; Rajeshuni Ramesham, Editor(s)

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