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Proceedings Paper

Laser forward transfer for digital microfabrication
Author(s): Alberto Piqué; Heungsoo Kim; Ray Auyeung; Andrew Birnbaum; Nicholas Charipar; Kristin Metkus; Scott Mathews
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Paper Abstract

Digital microfabrication processes are non-lithographic techniques ideally capable of directly generating patterns and structures of functional materials for the rapid prototyping of electronic, optical and sensor devices. Laser Direct-Write is an example of digital microfabrication that offers unique advantages and capabilities. A key advantage of laser directwrite techniques is their compatibility with a wide range of materials, surface chemistries and surface morphologies. These processes have been demonstrated in the fabrication of a wide variety of microelectronic elements such as interconnects, passives, antennas, sensors, power sources and embedded circuits. Recently, a novel laser direct-write technique able to digitally microfabricate thin film-like structures has been developed at the Naval Research Laboratory. This technique, known as Laser Decal Transfer, is capable of generating patterns with excellent lateral resolution and thickness uniformity using high viscosity metallic nano-inks. The high degree of control in size and shape achievable has been applied to the digital microfabrication of 3-dimensional stacked assemblies, MEMS-like structures and freestanding interconnects. Overall, laser forward transfer is perhaps the most flexible digital microfabrication process available in terms of materials versatility, substrate compatibility and range of speed, scale and resolution. This paper will describe the unique advantages and capabilities of laser decal transfer, discuss its applications and explore its role in the future of digital microfabrication.

Paper Details

Date Published: 21 February 2011
PDF: 6 pages
Proc. SPIE 7921, Laser-based Micro- and Nanopackaging and Assembly V, 792104 (21 February 2011); doi: 10.1117/12.870998
Show Author Affiliations
Alberto Piqué, U.S. Naval Research Lab. (United States)
Heungsoo Kim, U.S. Naval Research Lab. (United States)
Ray Auyeung, U.S. Naval Research Lab. (United States)
Andrew Birnbaum, U.S. Naval Research Lab. (United States)
Nicholas Charipar, U.S. Naval Research Lab. (United States)
Kristin Metkus, U.S. Naval Research Lab. (United States)
Scott Mathews, U.S. Naval Research Lab. (United States)


Published in SPIE Proceedings Vol. 7921:
Laser-based Micro- and Nanopackaging and Assembly V
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio, Editor(s)

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