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Proceedings Paper

Profile measurement based on spectral interferometer with multi-wavelength back-propagation methods
Author(s): Kohei Otsuki; Samuel Choi; Osami Sasaki; Takamasa Suzuki
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Paper Abstract

The multi-wavelength back-propagation (MWB) method enables to determine precisely the optical path different (OPD) longer than the optical wavelength from detecting the amplitude and phase of the interference signal for the multiple wavelengths. In this study, we demonstrate a 1-dimensional thickness profile measurement by the MWB and sinusoidal phase modulation (SPM) technique with a spectral interferometer. The OPD for the front and rear reflecting surfaces of a glass film with the thickness of 100 μm are measured. The thickness profile is successfully measured with repeatability of 2 nm estimated from a standard error between 9 repeatedly-measured profiles.

Paper Details

Date Published: 11 November 2010
PDF: 8 pages
Proc. SPIE 7855, Optical Metrology and Inspection for Industrial Applications, 78550R (11 November 2010); doi: 10.1117/12.870987
Show Author Affiliations
Kohei Otsuki, Niigata Univ. (Japan)
Samuel Choi, Niigata Univ. (Japan)
Osami Sasaki, Niigata Univ. (Japan)
Takamasa Suzuki, Niigata Univ. (Japan)


Published in SPIE Proceedings Vol. 7855:
Optical Metrology and Inspection for Industrial Applications
Kevin Harding; Peisen S. Huang; Toru Yoshizawa, Editor(s)

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