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Proceedings Paper

Electromagnetic optimization of high-speed TO laser modules
Author(s): Wei Han; Peter O'Brien; Marc Rensing; Hua Yang; Frank H. Peters
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Paper Abstract

The packaging aspect of the high-speed TO laser module has been investigated in this paper. A conventional TO 56 package is employed for compact and low cost high-speed applications. In the TO header, a special designed RF substrate is developed to minimize the RF reflection and insert loss. The influence of the feedthrough and the TO leads on signal transmission is analyzed using the electromagnetic (EM) method. A testing interface PCB based on the tapered coplanar waveguide (CPW) transmission line is proposed, and simulation results indicate that the coaxial type TO package has an insert loss of 1.5dB at 10GHz. In order to improve the electronic performance of the TO module, the equivalent circuit is built and a bandwidth compensation circuit is introduced, and results show that the 3dB bandwidth of the TO package can extend to 16.3GHz.

Paper Details

Date Published: 13 November 2010
PDF: 7 pages
Proc. SPIE 7844, Semiconductor Lasers and Applications IV, 78440O (13 November 2010); doi: 10.1117/12.870549
Show Author Affiliations
Wei Han, Tyndall National Institute (Ireland)
Peter O'Brien, Tyndall National Institute (Ireland)
Marc Rensing, Tyndall National Institute (Ireland)
Hua Yang, Tyndall National Institute (Ireland)
Frank H. Peters, Tyndall National Institute (Ireland)
Univ. College Cork (Ireland)


Published in SPIE Proceedings Vol. 7844:
Semiconductor Lasers and Applications IV
Ning-Hua Zhu; Jinmin Li; Farzin Amzajerdian; Hiroyuki Suzuki, Editor(s)

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