Share Email Print

Proceedings Paper

Comparisons of the new thick negative resist to Su8 resist
Author(s): D. Bourrier; M. Dilhan; A. Ghannam; H. Granier
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This work deals with recent advances in the microfabrication process technology for medium to high-aspect ratio structures fabricated by UV photolithography using different kinds of photoresists. The resulting structures were used as molds and will be transformed into metal structures by electroplating. Two types of photoresists are compared: epoxy-based (negative) SU-8 and acrylate-based (negative) Intervia BPN. This work was prompted by the need to find an alternative to SU-8 photoresist which is difficult to process and remove after electroplating. The results presented in this paper open up new possibilities for low-cost processes using electroplating in MEMS applications.

Paper Details

Date Published: 15 April 2011
PDF: 8 pages
Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 79722F (15 April 2011); doi: 10.1117/12.870496
Show Author Affiliations
D. Bourrier, LAAS, CNRS (France)
Univ. de Toulouse (France)
M. Dilhan, LAAS, CNRS (France)
Univ. de Toulouse (France)
A. Ghannam, LAAS, CNRS (France)
Univ. de Toulouse (France)
H. Granier, LAAS, CNRS (France)
Univ. de Toulouse (France)

Published in SPIE Proceedings Vol. 7972:
Advances in Resist Materials and Processing Technology XXVIII
Robert D. Allen; Mark H. Somervell, Editor(s)

© SPIE. Terms of Use
Back to Top