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Proceedings Paper

InGaAs detector arrays hermetic encapsulation technology
Author(s): Qinfei Xu; Dafu Liu
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Paper Abstract

In this paper, 256×1 and 512×1 element linear InGaAs detector arrays are hermetic packaged. Some processes were studied, including the structure design, thermoelectric cooler (TEC) heat load performance test, TEC vacuum baking, the window sealing, the seam welding of the cover lid and shell, and so on. The results show that the cooling temperature difference of TEC can reach over 55 K at room temperature, and it decreases by about 0.51 K with each additional 50 mW heat load. TEC works well after 500 hours of baking at 120 °C. The leakage rate tests show the assembly is better than 10-5 Pa.cm3/s.

Paper Details

Date Published: 18 November 2010
PDF: 7 pages
Proc. SPIE 7847, Optoelectronic Devices and Integration III, 78472H (18 November 2010); doi: 10.1117/12.870098
Show Author Affiliations
Qinfei Xu, Shanghai Institute of Technical Physics (China)
Dafu Liu, Shanghai Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 7847:
Optoelectronic Devices and Integration III
Xuping Zhang; Hai Ming; Alan Xiaolong Wang, Editor(s)

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