Share Email Print
cover

Proceedings Paper

Research on thermal characteristics of electronic devices using thermal microscopes
Author(s): Lu Gao; Jihui Wang; Weiqi Jin; Xingdao He
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Electronic devices are widely used in various industries, their temperature distribution cannot be obtained by traditional test methods. In recent years, simulation softwares are used to simulate the thermal characteristics of electronic devices and play a positive role on the reliability improvement, on the contrast, their validity cannot be verified. In this paper, the chip temperature rise process is simulated by ICEPEAK software. Some factors that change thermal characteristics are analyzed. The actual working temperature obtained by the thermal microscope is compared with the simulation temperature. The validity of simulation temperature is tested and the relation is built between the actual temperature and simulation temperature. Finally, it is pointed that thermal microscopes are the development direction on the electronic devices design and reliability testing.

Paper Details

Date Published: 4 November 2010
PDF: 10 pages
Proc. SPIE 7854, Infrared, Millimeter Wave, and Terahertz Technologies, 78543I (4 November 2010); doi: 10.1117/12.869621
Show Author Affiliations
Lu Gao, Beijing Institute of Technology (China)
Jihui Wang, Nanchang Hangkong Univ. (China)
Beijing Institute of Technology (China)
Weiqi Jin, Beijing Institute of Technology (China)
Xingdao He, Nanchang Hangkong Univ. (China)


Published in SPIE Proceedings Vol. 7854:
Infrared, Millimeter Wave, and Terahertz Technologies
Cunlin Zhang; Xi-Cheng Zhang; Peter H. Siegel; Li He; Sheng-Cai Shi, Editor(s)

© SPIE. Terms of Use
Back to Top