Share Email Print

Proceedings Paper

Vacuum packaging design and analysis for UFPA
Author(s): Dafu Liu; Qinfei Xu
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Uncooled focal plane array (UFPA) has broad application prospects in civilian and space because it's cheaper, more compact and high reliability. Many research institutes and companies have carried out the research of uncooled focal plane array. This paper shows a vacuum package design of UFPA, and its architecture will be given. The assembly is an all-metal vacuum package, which has been proven rugged and reliable. Out-gassing, permeation, evaporator, and air leak are factors to reduce the component vacuum lifetime. Theoretical analysis shows that material out-gassing is the main factor of pressure rise inside package. Theoretical analysis and calculation show that designed metallic structure can meet the need of 10-years life.

Paper Details

Date Published: 16 November 2010
PDF: 7 pages
Proc. SPIE 7847, Optoelectronic Devices and Integration III, 78471Y (16 November 2010); doi: 10.1117/12.868893
Show Author Affiliations
Dafu Liu, Shanghai Institute of Technical Physics (China)
Qinfei Xu, Shanghai Institute of Technical Physics (China)

Published in SPIE Proceedings Vol. 7847:
Optoelectronic Devices and Integration III
Xuping Zhang; Hai Ming; Alan Xiaolong Wang, Editor(s)

© SPIE. Terms of Use
Back to Top