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Proceedings Paper

Terahertz imaging technique and application in large scale integrated circuit failure inspection
Author(s): Zhi-gang Di; Jian-quan Yao; Chun-rong Jia; De-gang Xu; Pi-bin Bing; Peng-fei Yang; Yi-bo Zheng
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Paper Abstract

Terahertz ray, as a new style optic source, usually means the electromagnetic whose frequencies lies in between 0.1THz~10THz, the waveband region of the electromagnetic spectrum lies in the gap between microwaves and infrared ray. With the development of laser techniques, quantum trap techniques and compound semiconductor techniques, many new terahertz techniques have been pioneered, motivated in part by the vast range of possible applications for terahertz imaging, sensing, and spectroscopy. THz imaging technique was introduced, and THz imaging can give us not only the density picture but also the phase information within frequency domain. Consequently, images of suspicious objects such as concealed metallic or metal weapons are much sharper and more readily identified when imaged with THz imaging scanners. On the base of these, the application of THz imaging in nondestructive examination, more concretely in large scale circuit failure inspection was illuminated, and the important techniques of this application were introduced, also future prospects were discussed. With the development of correlative technology of THz, we can draw a conclusion that THz imaging technology will have nice application foreground.

Paper Details

Date Published: 4 November 2010
PDF: 10 pages
Proc. SPIE 7854, Infrared, Millimeter Wave, and Terahertz Technologies, 78542L (4 November 2010); doi: 10.1117/12.868797
Show Author Affiliations
Zhi-gang Di, Tianjin Univ. (China)
Hebei Univ. (China)
Jian-quan Yao, Tianjin Univ. (China)
Chun-rong Jia, Hebei Univ. (China)
De-gang Xu, Tianjin Univ. (China)
Pi-bin Bing, Tianjin Univ. (China)
Peng-fei Yang, Tianjin Univ. (China)
Yi-bo Zheng, Tianjin Univ. (China)

Published in SPIE Proceedings Vol. 7854:
Infrared, Millimeter Wave, and Terahertz Technologies
Cunlin Zhang; Xi-Cheng Zhang; Peter H. Siegel; Li He; Sheng-Cai Shi, Editor(s)

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