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Proceedings Paper

Advanced mask-to-mask overlay analysis for next generation technology node reticles
Author(s): Klaus-Dieter Roeth; Frank Laske; Karl-Heinrich Schmidt; Dieter Adam; Oliver Ache; David Ilsen
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Paper Abstract

Double Patterning Lithography (DPL) for next-generation wafer exposure is placing greater demands on the requirements for pattern placement accuracy on photomasks: the DPL mask pair must now meet the pattern placement specifications that a single mask was required to meet in previous generations. As a result, each mask in the mask pair must individually conform to much tighter mask registration specs. Minimizing all sources of systematic overlay error has become critical. In addition, the mask-to-mask overlay between the two masks comprising the DPL pair must be measured-a methodology shift from the current practice of referencing mask registration error only to design data. Characterizing mask-to-mask overlay error requires the ability to measure pattern placement errors using in-die structures on reticle pairs. Today's analysis methods do not allow for comparison of registration maps based on different site locations. This gap has created a lack of information about the true overlay impact of mask-to-mask registration errors on masks with few or no common features. A new mask-to-mask overlay analysis method is demonstrated that provides new flexibility for mask-to-mask comparison. This new method enables mask manufacturers to meet fab requirements for DPL, and it enables semiconductor manufacturers to verify if overlay deviations are within acceptable limits.

Paper Details

Date Published: 27 May 2010
PDF: 9 pages
Proc. SPIE 7748, Photomask and Next-Generation Lithography Mask Technology XVII, 77480L (27 May 2010); doi: 10.1117/12.867720
Show Author Affiliations
Klaus-Dieter Roeth, KLA-Tencor MIE GmbH (Germany)
Frank Laske, KLA-Tencor MIE GmbH (Germany)
Karl-Heinrich Schmidt, KLA-Tencor MIE GmbH (Germany)
Dieter Adam, KLA-Tencor MIE GmbH (Germany)
Oliver Ache, KLA-Tencor MIE GmbH (Germany)
David Ilsen, KLA-Tencor MIE GmbH (Germany)

Published in SPIE Proceedings Vol. 7748:
Photomask and Next-Generation Lithography Mask Technology XVII
Kunihiro Hosono, Editor(s)

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