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Proceedings Paper

Alignment for double-side deep-exposure lithography tool
Author(s): Ping Ma; Xiaofang Fu; Chunli Yang; Song Hu; Xiaoping Tang
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Paper Abstract

The paper presents and discusses several prevalent methods for lithography alignment, and then describes and emphasizes the principle, mechanical structure and alignment procedure of the bottom-side alignment (BSA) system for deep-exposure lithography tool. Also, the error source degrading the precision of the alignment system is analyzed. Other related techniques and methods are provided. In the end, the aligned reticle image shows that the system is proved to be stable, reliable and capable of meeting the required precision when it is applied to DUV double-side deep-exposure mask aligner.

Paper Details

Date Published: 22 October 2010
PDF: 6 pages
Proc. SPIE 7657, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 76571W (22 October 2010); doi: 10.1117/12.867698
Show Author Affiliations
Ping Ma, Institute of Optics and Electronics (China)
Xiaofang Fu, Institute of Optics and Electronics (China)
Chunli Yang, Institute of Optics and Electronics (China)
Song Hu, Institute of Optics and Electronics (China)
Xiaoping Tang, Institute of Optics and Electronics (China)


Published in SPIE Proceedings Vol. 7657:
5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems
Tianchun Ye; Sen Han; Masaomi Kameyama; Song Hu, Editor(s)

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