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Proceedings Paper

Wear characteristics of diamond wheel in elliptical ultrasonic assisted grinding (EUAG) of monocrystal silicon
Author(s): Z. Q. Liang; X. B. Wang; Y. B. Wu; W. X. Zhao; Y. F. Peng; T. Sato
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Paper Abstract

This paper experimentally investigated the wear characteristics of diamond wheel in elliptical ultrasonic assisted grinding of monocrystal silicon. In this method, the monocrystal silicon workpiece attached on an elliptical ultrasonic vibrator vibrates ultrasonically in two directions: one is vertical to the work-surface; another is along the wheel axis. The vibrator is produced by bonding a piezoelectric ceramic (PZT) device on a metal elastic body and ultrasonically vibrates in 2D vibration mode when the PZT is excited by two alternating current voltages with a phase difference. Our previous experimental works showed that under the elliptical ultrasonic assistance the grinding forces are decreased by 30% and the surface roughness is improved by 20%. In this paper, in order to investigate the mechanism of wheel wear in EUAG, surface grinding experiments were carried out using a resin bond diamond wheel with a replaceable insert. The wheel surface and work-surface after grinding were observed directly by SEM. The obtained experiment results show that the main mechanism of wheel wear in EUAG is the micro-fracture and cleavage of the diamond grain, but that in CG is grit flattening and pullout. Moreover, the workpiece surface quality in EUAG is much better than that in CG. These indicate that the elliptical ultrasonic assisted grinding is an effective method for high efficiency and high quality grinding of monocrystal silicon.

Paper Details

Date Published: 6 October 2010
PDF: 5 pages
Proc. SPIE 7655, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 765535 (6 October 2010); doi: 10.1117/12.867210
Show Author Affiliations
Z. Q. Liang, Beijing Institute of Technology (China)
Akita Prefectural Univ. (Japan)
X. B. Wang, Beijing Institute of Technology (China)
Y. B. Wu, Akita Prefectural Univ. (Japan)
W. X. Zhao, Beijing Institute of Technology (China)
Y. F. Peng, Xiamen Univ. (China)
T. Sato, Akita Prefectural Univ. (Japan)


Published in SPIE Proceedings Vol. 7655:
5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Li Yang; Yoshiharu Namba; David D. Walker; Shengyi Li, Editor(s)

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