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Proceedings Paper

Calculation and simulation of the uniformity of grinding removal in ring polishing
Author(s): Lishuan Wang; Zhengxiang Shen; Yiqin Ji
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Paper Abstract

Ring polishing, also called continuous polishing, plays a very important role in the manufacturing of plane optical components with large aperture. This paper theoretically analyses the problem of calculation and simulation of the uniformity of grinding removal in ring polishing. By using the MATLAB software, a series of simulation figures are given. Firstly, the relative motion path on the polishing lap of a point on the workpiece is obtained by programming. From the simulation results it could draw a conclusion that the motion path is complicated when rotating speed ratio is not equal to one. Thus, it's beneficial to the homogeneous material removal. Focus on the problem of the uniformity of grinding removal, then, this paper elaborates on the effect of material relative removal caused by factors such as rotating speed ratio and eccentricity theoretically. When the size of the workpiece is large enough, it will be outside of the optical polishing pitch lap, and this paper will also discuss the material removal on the whole surface in this case. All the calculation and simulation will guide practice process.

Paper Details

Date Published: 7 October 2010
PDF: 10 pages
Proc. SPIE 7655, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 76552I (7 October 2010); doi: 10.1117/12.866762
Show Author Affiliations
Lishuan Wang, Tianjin Jinhang Institute of Technical Physics (China)
Zhengxiang Shen, Tongji Univ. (China)
Yiqin Ji, Tianjin Jinhang Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 7655:
5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Li Yang; Yoshiharu Namba; David D. Walker; Shengyi Li, Editor(s)

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