Share Email Print

Proceedings Paper

An advanced modeling approach for mask and wafer process simulation
Author(s): Ahmet Karakas; Erich Elsen; Ilhami Torunoglu; Curtis Andrus
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

A new modeling technique to accurately represent the mask and wafer process behavior is presented. The lithography simulation can be done in three steps: i) mask simulation, ii) latent image calculations and iii) resist process simulation. The leading edge designs, such as 32 nm and beyond, require higher-fidelity models to adequately represent each of these actual processes. Effects previously considered secondary, have become more pronounced with each new technology node. In this approach, we utilized separate physical models for both mask and wafer processes. We demonstrate that the residual errors can be further reduced when nonlinear mappers are used in addition. The advantage of the presented approach compared to standard curve-fitting or statistics-based models is its predictive power and adaptive nature. The physical model parameters were calibrated by a genetic algorithm whose details were outlined in [1]. The nonlinear mapper model parameters were identified by a gradient descent method. Given the computational requirements for a practical solution, our approach uses graphics processors as well as CPUs as computation hardware.

Paper Details

Date Published: 25 September 2010
PDF: 9 pages
Proc. SPIE 7823, Photomask Technology 2010, 78230X (25 September 2010); doi: 10.1117/12.866281
Show Author Affiliations
Ahmet Karakas, Gauda, Inc. (United States)
Erich Elsen, Gauda, Inc. (United States)
Ilhami Torunoglu, Gauda, Inc. (United States)
Curtis Andrus, Gauda, Inc. (United States)

Published in SPIE Proceedings Vol. 7823:
Photomask Technology 2010
M. Warren Montgomery; Wilhelm Maurer, Editor(s)

© SPIE. Terms of Use
Back to Top