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Proceedings Paper

Based on airborne multi-array butting for IRFPA staring imagery
Author(s): Minjun Mao; Gonghai Xiao; Yancheng Lin; Feng Xie; Rong Shu
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Paper Abstract

Because infrared system detects the radiation energy of the target, it has the ability to work all day that the visible-light detection system cannot achieve, at the same time, infrared system is a passive detection system, does not need active detection technology such as radar, which requires large radiation power or a larger expandable antenna. It is more suitable for airborne applications, therefore, infrared imaging based on the aircraft and aerostat platform, has been an important means of monitoring the ground. However, due to detector limitations, the spatial resolution of current infrared cameras or spectrographs and the total field coverage of view are generally not satisfied the customer's requirements. This paper proposes an airborne infrared camera imaging method based on multi-planar arrays, using frame-type imaging array. In order to provide large ground coverage together with good spatial resolution, the mirror is drove to scan rapidly by the galvanometer. The scanning mirror works at staring imagery mode. During multi-planar detectors exposure and imaging, the mirror moves to the staring position. There is more than 10 % overlapping sensor foot prints between two adjacent frames, and the functions of image matching algorithms are used to ensure the seamless butting. This imaging method improves the system integration time, and effectively improves the sensitivity of infrared systems; frame-type imaging solves the serious image distortion caused by the platform attitude.

Paper Details

Date Published: 22 October 2010
PDF: 8 pages
Proc. SPIE 7658, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Detector, Imager, Display, and Energy Conversion Technology, 765858 (22 October 2010); doi: 10.1117/12.865976
Show Author Affiliations
Minjun Mao, Shanghai Institute of Technical Physics (China)
Gonghai Xiao, Shanghai Institute of Technical Physics (China)
Yancheng Lin, Shanghai Institute of Technical Physics (China)
Feng Xie, Shanghai Institute of Technical Physics (China)
Rong Shu, Shanghai Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 7658:
5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Detector, Imager, Display, and Energy Conversion Technology
Yadong Jiang; Bernard Kippelen; Junsheng Yu, Editor(s)

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