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Proceedings Paper

128×128 dual-color ROIC with electrical crosstalk resistant design
Author(s): Wei Lu; Ruijun Ding; Xiaoyang Liu; Chun Zhou
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Paper Abstract

Dual-color(MWIR/SWIR)infrared focal plane array with sequence integration mode. It can export two bands photocurrent signal under irradiation. In order to deal with the signal electrical crosstalk problem which the unstable and large variant bias voltage of N-P+-N HgCdTe infrared detectors bring while two bands switch, A novel modified DI (MDI)circuit structure based on adjusting the bias voltage is presented. Through controlling timing sequence, MWIR and SWIR signal are integrated in turn and readout at the same time. The chips of 128×128 ROIC are designed and fabricated with 0.6 um double poly double metal mixed signal technology. The simulation shows right function of the circuit. Power dissipation of analog module is 20 mW, that of digital module is 10.25 uW and it has been tapped out.

Paper Details

Date Published: 22 October 2010
PDF: 7 pages
Proc. SPIE 7658, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Detector, Imager, Display, and Energy Conversion Technology, 76585Z (22 October 2010); doi: 10.1117/12.865926
Show Author Affiliations
Wei Lu, Shanghai Institute of Technical Physics (China)
Graduate Univ. of Chinese Academy of Sciences (China)
Ruijun Ding, Shanghai Institute of Technical Physics (China)
Xiaoyang Liu, Shanghai Institute of Technical Physics (China)
Graduate Univ. of Chinese Academy of Sciences (China)
Chun Zhou, Shanghai Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 7658:
5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Detector, Imager, Display, and Energy Conversion Technology
Yadong Jiang; Bernard Kippelen; Junsheng Yu, Editor(s)

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