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Proceedings Paper

Inspection of advanced computational lithography logic reticles using a 193-nm inspection system
Author(s): Ching-Fang Yu; Mei-Chun Lin; Mei-Tsu Lai; Luke T.H. Hsu; Angus Chin; S. C. Lee; Anthony Yen; Jim Wang; Ellison Chen; David Wu; William H. Broadbent; William Huang; Zinggang Zhu
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Paper Abstract

We report inspection results of early 22-nm logic reticles designed with both conventional and computational lithography methods. Inspection is performed using a state-of-the-art 193-nm reticle inspection system in the reticleplane inspection mode (RPI) where both rule-based sensitivity control (RSC) and a newer modelbased sensitivity control (MSC) method are tested. The evaluation includes defect detection performance using several special test reticles designed with both conventional and computational lithography methods; the reticles contain a variety of programmed critical defects which are measured based on wafer print impact. Also included are inspection results from several full-field product reticles designed with both conventional and computational lithography methods to determine if low nuisance-defect counts can be achieved. These early reticles are largely single-die and all inspections are performed in the die-to-database inspection mode only.

Paper Details

Date Published: 29 September 2010
PDF: 7 pages
Proc. SPIE 7823, Photomask Technology 2010, 78232F (29 September 2010); doi: 10.1117/12.865604
Show Author Affiliations
Ching-Fang Yu, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Mei-Chun Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Mei-Tsu Lai, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Luke T.H. Hsu, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Angus Chin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
S. C. Lee, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Anthony Yen, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Jim Wang, KLA-Tencor Corp. Taiwan (Taiwan)
Ellison Chen, KLA-Tencor Corp. Taiwan (Taiwan)
David Wu, KLA-Tencor Corp. Taiwan (Taiwan)
William H. Broadbent, KLA-Tencor Corp. (United States)
William Huang, KLA-Tencor Corp. (United States)
Zinggang Zhu, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 7823:
Photomask Technology 2010
M. Warren Montgomery; Wilhelm Maurer, Editor(s)

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