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Proceedings Paper

Development of uncooled antenna-coupled microbolometer arrays for explosive detection and identification
Author(s): F. Simoens; A. Arnaud; P. Castelein; V. Goudon; P. Imperinetti; J. Lalanne Dera; J. Meilhan; J. L. Ouvier Buffet; S. Pocas; T. Maillou; L. Hairault; P. Gellie; S. Barbieri; C. Sirtori
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Paper Abstract

Uncooled antenna-coupled microbolometer focal plane arrays have been specifically tailored for optimum performance in the 1-5 Terahertz range. A prototyping batch of 160 × 120 pixel chips has been designed and then processed above 8" silicon substrates. An actively illuminated system has been experimentally tested where Quantum Cascade Lasers (QCLs) are associated with the room-temperature operating 2D sensor. Whereas explosives samples were introduced in the THz beam optical path, the profile of the modified beam has been sensed by a unique pixel translated via an X-Y stage. These represent the first demonstration essays of explosive identification using our system.

Paper Details

Date Published: 12 October 2010
PDF: 11 pages
Proc. SPIE 7837, Millimetre Wave and Terahertz Sensors and Technology III, 78370B (12 October 2010); doi: 10.1117/12.865189
Show Author Affiliations
F. Simoens, CEA-Leti, MINATEC (France)
A. Arnaud, CEA-Leti, MINATEC (France)
P. Castelein, CEA-Leti, MINATEC (France)
V. Goudon, CEA-Leti, MINATEC (France)
P. Imperinetti, CEA-Leti, MINATEC (France)
J. Lalanne Dera, CEA-Leti, MINATEC (France)
J. Meilhan, CEA-Leti, MINATEC (France)
J. L. Ouvier Buffet, CEA-Leti, MINATEC (France)
S. Pocas, CEA-Leti, MINATEC (France)
T. Maillou, CEA Le Ripault (France)
L. Hairault, CEA Le Ripault (France)
P. Gellie, Lab. Matériaux et phénomènes quantiques, CNRS, Univ. Paris 7-Denis Diderot (France)
S. Barbieri, Lab. Matériaux et phénomènes quantiques, CNRS, Univ. Paris 7-Denis Diderot (France)
C. Sirtori, Lab. Matériaux et phénomènes quantiques, CNRS, Univ. Paris 7-Denis Diderot (France)


Published in SPIE Proceedings Vol. 7837:
Millimetre Wave and Terahertz Sensors and Technology III
Keith A. Krapels; Neil A. Salmon, Editor(s)

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