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Proceedings Paper

Evaluation of easily removable pellicle adhesive
Author(s): Nancy Zhou; Monica Barrett; Robert Nolan; Dennis Plouffe; Jason Ritter; Alfred Wagner; Michael Caterer; Takashi Mizoguchi; Satoshi Akutagawa; Kevin Duong; Corbin Imai; C. B. Wang
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Paper Abstract

With the advancement of technology, the need to produce flatter photomasks is critical to meet strict mask manufacturing requirements. Components such as pellicle mounting techniques, pellicle frame height, frame material and adhesive all play an important role in finished photomask flatness.1-5 In particular, recent studies have shown that adhesive flexibility affect final photomask flatness significantly.6 This has motivated pellicle suppliers to optimize adhesive properties in addition to evaluate new adhesives. The paper describes the joint evaluations between IBM, Toppan and MLI, performed to determine the effect of a new MLI adhesive on the distortion of photomasks. Due to the nature of this adhesive, minimal mounting force is required. As a result of utilizing extreme low mounting pressure, benefits such as decreased flatness distortion and ease of adhesive removal are observed. The goal of this paper is to evaluate this new adhesive offering and understand the various impacts it has on pelliclized photomasks for advanced technologies.

Paper Details

Date Published: 25 May 2010
PDF: 7 pages
Proc. SPIE 7748, Photomask and Next-Generation Lithography Mask Technology XVII, 774810 (25 May 2010); doi: 10.1117/12.865042
Show Author Affiliations
Nancy Zhou, IBM Corp. (United States)
Monica Barrett, IBM Corp. (United States)
Robert Nolan, IBM Corp. (United States)
Dennis Plouffe, IBM Corp. (United States)
Jason Ritter, IBM Corp. (United States)
Alfred Wagner, IBM Corp. (United States)
Michael Caterer, IBM Corp. (United States)
Takashi Mizoguchi, Toppan Photomasks, Inc. (United States)
Satoshi Akutagawa, Toppan Photomasks, Inc. (United States)
Kevin Duong, Micro Lithography, Inc. (United States)
Corbin Imai, Zysan Corp. (United States)
C. B. Wang, Micro Lithography, Inc. (United States)

Published in SPIE Proceedings Vol. 7748:
Photomask and Next-Generation Lithography Mask Technology XVII
Kunihiro Hosono, Editor(s)

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