Share Email Print
cover

Proceedings Paper

In-Die registration metrology: design data preparation solution
Author(s): Frank Laske; Loc Ho; Michael Ferber; Klaus-Dieter Roeth; Dieter Adam; Stephen Kim; Seurien Chou
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Double Patterning Lithography (DPL) for next generation wafer exposure is placing greater demands on the requirements for pattern placement accuracy on photomasks. Recent studies have shown that pattern placement accuracy can be one of the largest components of systematic wafer overlay error. Since LELE or LFLE DPL technologies tighten intra-field-wafer overlay requirements by as much as a factor of 2 (to 2 - 3nm for critical layers), minimizing all sources of systematic overlay error has become critical. In addition to its impact on overlay performance, any significant pattern displacement between the two exposures in a double patterning scheme will have a significant impact on CD uniformity, another major area of concern for next-generation devices. In the past, mask registration has been referenced to design data using relatively large, specially designed targets. However, as shown in many previous papers [2], the true registration error of a next-generation reticle cannot be sufficiently described by using today's sampling plans. In order to address this issue, it is mandatory to have In-Die registration capability for next generation reticle registration. On this path to In-Die pattern placement metrology many challenges have to be solved. One is the data preparation necessary to get the targets placed and marked within the design, preparing for the later metrology step. This paper demonstrates an automated way of performing In-Die registration metrology. This new approach allows more flexible and higher density metrology so that pattern placement error is sufficiently well characterized.

Paper Details

Date Published: 25 September 2010
PDF: 11 pages
Proc. SPIE 7823, Photomask Technology 2010, 78232M (25 September 2010); doi: 10.1117/12.864281
Show Author Affiliations
Frank Laske, KLA-Tencor MIE GmbH (Germany)
Loc Ho, KLA-Tencor MIE GmbH (Germany)
Michael Ferber, KLA-Tencor MIE GmbH (Germany)
Klaus-Dieter Roeth, KLA-Tencor MIE GmbH (Germany)
Dieter Adam, KLA-Tencor MIE GmbH (Germany)
Stephen Kim, Synopsys, Inc. (United States)
Seurien Chou, Synopsys, Inc. (United States)


Published in SPIE Proceedings Vol. 7823:
Photomask Technology 2010
M. Warren Montgomery; Wilhelm Maurer, Editor(s)

© SPIE. Terms of Use
Back to Top