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Proceedings Paper

eMET: 50 keV electron mask exposure tool development based on proven multi-beam projection technology
Author(s): Elmar Platzgummer; Stefan Cernusca; Christof Klein; Jan Klikovits; Samuel Kvasnica; Hans Loeschner
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Paper Abstract

Multi-beam writing becomes mandatory for future technology nodes in order to stay within reasonable realization times for leading-edge complex masks and templates. IMS Nanofabrication has developed multi-beam projection techniques implementing a programmable aperture plate system (APS) and charged-particle projection optics with 200x reduction. Proof-of-concept of multi-beam writing on static substrates was demonstrated in 2009 using the CHARPAN tool with 10keV ion multi-beams and the RIMANA tool with 50keV electron multi-beams. For the first time projection multibeam writing on moving substrates is presented as made achievable by upgrading the CHARPAN Tool with a laserinterferometer controlled stage to realize a POWS (Proof-Of-Writing-Strategy) tool configuration. With the RIMANA Tool 50keV e-beam exposures of ILT (Inverse Lithography Technique) patterns are demonstrated.. The status of the development of a 50keV electron Mask Exposure Tool (eMET) is presented and the targeted writing speeds of eMET POC and eMET HVM systems are outlined.

Paper Details

Date Published: 29 September 2010
PDF: 12 pages
Proc. SPIE 7823, Photomask Technology 2010, 782308 (29 September 2010); doi: 10.1117/12.864261
Show Author Affiliations
Elmar Platzgummer, IMS Nanofabrication AG (Austria)
Stefan Cernusca, IMS Nanofabrication AG (Austria)
Christof Klein, IMS Nanofabrication AG (Austria)
Jan Klikovits, IMS Nanofabrication AG (Austria)
Samuel Kvasnica, IMS Nanofabrication AG (Austria)
Hans Loeschner, IMS Nanofabrication AG (Austria)

Published in SPIE Proceedings Vol. 7823:
Photomask Technology 2010
M. Warren Montgomery; Wilhelm Maurer, Editor(s)

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