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Proceedings Paper

Research on the planarizaion of the large optic wafer in the fast polishing process
Author(s): Wei Yang; Jing Lin; YinBiao Guo
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Paper Abstract

This paper researches on the planarization of the large optic wafer in the fast polishing process (FPP). In the FPP, the MRR (material removal rate) of the large optic wafer can reach 5~10 um/h. However, the planarization of the wafer is still a problem. Thus, this paper uses the revised skin model to analyze the non-uniform pressure distribution which results in the non-planarization of the wafer. At last, some experiments are done to see which parameter can be chosen to avoid the non-uniform pressure distribution and get the good wafer planarization.

Paper Details

Date Published: 7 October 2010
PDF: 6 pages
Proc. SPIE 7655, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 765514 (7 October 2010); doi: 10.1117/12.863594
Show Author Affiliations
Wei Yang, Xiamen Univ. (China)
Jing Lin, Xiamen Univ. (China)
YinBiao Guo, Xiamen Univ. (China)


Published in SPIE Proceedings Vol. 7655:
5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Li Yang; Yoshiharu Namba; David D. Walker; Shengyi Li, Editor(s)

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