Share Email Print
cover

Proceedings Paper

OTFT backplanes for integration into flexible displays
Author(s): Michael D. Cooke; Keri L. McCall; David P. Bird; Yong Uk Lee; Tim Pease; Sam Y. F. Chan; Marco Palumbo; Steve McGloin; Simon D. Ogier
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Recent developments in high performance organic semiconductor (OSC) materials have shown charge mobilities in the range of 2 to 5 cm2/Vs. We present our progress in fabricating organic thin film transistor (OTFT) backplanes using a low temperature process (100°C maximum) and the prospects for integration into flexible displays. Discussion is made of the fabrication process using typical flat panel display equipment as well as the possibility of further device enhancement using ink jet printing technologies. We show the feasibility of achieving an average panel mobility of >1 cm2/Vs on a range of transistor array sizes. Electrical data is presented to show how the parameters of interest, (mobility, on/off ratio, Vth), vary across an array as well as some of the scaling factors that will be important for the final device architecture. Finally, we discuss how these devices have the potential for integration into a range of displays (for example, e-paper and OLEDs) for commercial exploitation.

Paper Details

Date Published: 17 August 2010
PDF: 6 pages
Proc. SPIE 7778, Organic Field-Effect Transistors IX, 777814 (17 August 2010); doi: 10.1117/12.862100
Show Author Affiliations
Michael D. Cooke, PETEC (United Kingdom)
Keri L. McCall, PETEC (United Kingdom)
David P. Bird, PETEC (United Kingdom)
Yong Uk Lee, PETEC (United Kingdom)
Tim Pease, PETEC (United Kingdom)
Sam Y. F. Chan, PETEC (United Kingdom)
Marco Palumbo, PETEC (United Kingdom)
Steve McGloin, PETEC (United Kingdom)
Simon D. Ogier, PETEC (United Kingdom)


Published in SPIE Proceedings Vol. 7778:
Organic Field-Effect Transistors IX
Zhenan Bao; Iain McCulloch, Editor(s)

© SPIE. Terms of Use
Back to Top