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Proceedings Paper

Reliability of fuzes based on diode laser assemblies
Author(s): M. Maiorov; D. Damm; I. Trofimov; V. Zeidel; R. Sellers
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Paper Abstract

We present an analysis of a reliability assessment tailored specifically to fuzes based on laser diode assemblies. Fuzes are required to deliver high energy in a single short pulse (micro- to milliseconds) after prolonged storage (tens of years) in thermally non-stabilized environments. The temperature variation could easily exceed 100 degrees, and the transition from one extreme to the other could be slow or rapid, depending on a particular application. The operating requirements for diode laser fuzes are dramatically different from the majority of other diode laser applications and thus a reliability assurance program for laser fuzes should reflect these differences in usage. In this paper we demonstrate that it is possible to build accelerated aging conditions based on thermal cycling. As parameters in the accelerated thermal aging, we used the total temperature difference between the lowest and the highest points in the cycle, and the average rate of temperature change between the extreme points. This accelerated aging technique based on thermal cycling can predict the performance deterioration over time after storage in thermally non-stabilized environments. The basis of this approach can be extended to the analysis of reliability in environments with high vibration and radiation levels.

Paper Details

Date Published: 3 September 2010
PDF: 10 pages
Proc. SPIE 7795, Optical Technologies for Arming, Safing, Fuzing, and Firing VI, 77950A (3 September 2010); doi: 10.1117/12.860987
Show Author Affiliations
M. Maiorov, AKELA Laser Corp. (United States)
D. Damm, Sandia National Labs. (United States)
I. Trofimov, AKELA Laser Corp. (United States)
V. Zeidel, AKELA Laser Corp. (United States)
R. Sellers, AKELA Laser Corp. (United States)


Published in SPIE Proceedings Vol. 7795:
Optical Technologies for Arming, Safing, Fuzing, and Firing VI
Fred M. Dickey; Richard A. Beyer, Editor(s)

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