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Proceedings Paper

Glass-encapsulant interface characterization following temperature and humidity exposure
Author(s): Katherine Stika; Rebecca Smith; Dennis Swartzfager; Donald Huang; Diane Davidson; James Marsh; Robert Agostinelli; John Wyre; Donald Brill; Roger Senigo
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Paper Abstract

The ability to optimize and consistently control the properties of the polymer-glass interface in thin film PV laminates in an important aspect of module reliability. Using variable rate peel delamination methods developed to isolate the encapsulant/glass interface, ion migration and interfacial chemistry have been studied following temperature and humidity exposure. In this presentation we will review quantitative AFM (Atomic Force Microscopy) and XPS (X-ray Photoelectron Spectroscopy) analyses linking failure modes with interfacial chemistry.

Paper Details

Date Published: 19 August 2010
PDF: 6 pages
Proc. SPIE 7773, Reliability of Photovoltaic Cells, Modules, Components, and Systems III, 777311 (19 August 2010); doi: 10.1117/12.860865
Show Author Affiliations
Katherine Stika, E.I. DuPont de Nemours & Co., Inc. (United States)
Rebecca Smith, E.I. DuPont de Nemours & Co., Inc. (United States)
Dennis Swartzfager, E.I. DuPont de Nemours & Co., Inc. (United States)
Donald Huang, E.I. DuPont de Nemours & Co., Inc. (United States)
Diane Davidson, E.I. DuPont de Nemours & Co., Inc. (United States)
James Marsh, E.I. DuPont de Nemours & Co., Inc. (United States)
Robert Agostinelli, E.I. DuPont de Nemours & Co., Inc. (United States)
John Wyre, E.I. DuPont de Nemours & Co., Inc. (United States)
Donald Brill, E.I. DuPont de Nemours & Co., Inc. (United States)
Roger Senigo, E.I. DuPont de Nemours & Co., Inc. (United States)


Published in SPIE Proceedings Vol. 7773:
Reliability of Photovoltaic Cells, Modules, Components, and Systems III
Neelkanth G. Dhere; John H. Wohlgemuth; Kevin Lynn, Editor(s)

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