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Proceedings Paper

Applying the dynamical model of drying process of a polymer solution coated on a flat substrate to effects of bumpy substrate
Author(s): Hiroyuki Kagami; Hiroshi Kubota
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Paper Abstract

We apply the former general dynamical model of drying process of polymer solution coated on a flat substrate for flat polymer film fabrication to concrete detailed subjects. Concretely we apply the model to effects of a bumpy substrate as an example. We understand that a humpy structure on a substrate does not affect nearly solute's distribution after drying because effects of diffusion around the hump are sufficiently effective as far as the hump interfere with diffusion. We also understand that when the beginning time of special vaporization near a hump is earlier, solute's distribution after drying except for at the edge's region is thinner a little because leveling including the edge's region by diffusion is more effective.

Paper Details

Date Published: 28 August 2010
PDF: 8 pages
Proc. SPIE 7764, Nanoengineering: Fabrication, Properties, Optics, and Devices VII, 77640T (28 August 2010); doi: 10.1117/12.860485
Show Author Affiliations
Hiroyuki Kagami, Nagoya College (Japan)
Hiroshi Kubota, Kumamoto Univ. (Japan)


Published in SPIE Proceedings Vol. 7764:
Nanoengineering: Fabrication, Properties, Optics, and Devices VII
Elizabeth A. Dobisz; Louay A. Eldada, Editor(s)

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