Share Email Print
cover

Proceedings Paper

Electroplated indium bumps as thermal and electrical connection of NTD Ge sensors for the fabrication of microcalorimeter arrays
Author(s): Ugo Lo Cicero; Claudio Arnone; Marco Barbera; Alfonso Collura; Giuseppe Lullo
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published:
PDF
Proc. SPIE 7742, High Energy, Optical, and Infrared Detectors for Astronomy IV, 77422D; doi: 10.1117/12.858913
Show Author Affiliations
Ugo Lo Cicero, Osservatorio Astronomico di Palermo Giuseppe S. Vaiana (Italy)
Univ. degli Studi di Palermo (Italy)
Claudio Arnone, Univ. degli Studi di Palermo (Italy)
Marco Barbera, Univ. degli Studi di Palermo (Italy)
INAF/Osservatorio Astronomico di Palermo (Italy)
Alfonso Collura, Osservatorio Astronomico di Palermo Giuseppe S. Vaiana (Italy)
Giuseppe Lullo, Univ. degli Studi di Palermo (Italy)


Published in SPIE Proceedings Vol. 7742:
High Energy, Optical, and Infrared Detectors for Astronomy IV
Andrew D. Holland; David A. Dorn, Editor(s)

© SPIE. Terms of Use
Back to Top