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Proceedings Paper

The BOOM project: a new generation of photonic routing subsystems using hybrid integration on silicon-on-insulator waveguide boards
Author(s): Leontios Stampoulidis; Konstantinos Vyrsokinos; Christos Stamatiadis; Hercules Avramopoulos; Lars Zimmermann; Karsten Voigt; Zhen Sheng; Dries Van Thourhout; Jochen Kreissl; Ludwig Mörl; Jens Bolten; Thorsten Wahlbrink; Fausto Gomez-Agis; Eduward Tangdiongga; Harmen J. S. Dorren; Annachiara Pagano; Emilio Riccardi
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Paper Abstract

The European BOOM project aims at the realization of high-capacity photonic routers using the silicon material as the base for functional and cost-effective integration. Here we present the design, fabrication and testing of the first BOOMgeneration of hybrid integrated silicon photonic devices that implement key photonic routing functionalities. Ultra-fast all-optical wavelength converters and micro-ring resonator UDWDM label photodetectors are realized using either 4um SOI rib or SOI nanowire boards. For the realization of these devices, flip-chip compatible non-linear SOAs and evanescent PIN detectors have been designed and fabricated. These active components are integrated on the SOI boards using high precision flip-chip mounting and heterogeneous InP-to-silicon integration techniques. This type of scalable and cost-effective silicon-based component fabrication opens up the possibility for the realization of chip-scale, power efficient, Tb/s capacity photonic routers.

Paper Details

Date Published: 17 May 2010
PDF: 8 pages
Proc. SPIE 7719, Silicon Photonics and Photonic Integrated Circuits II, 771909 (17 May 2010); doi: 10.1117/12.855958
Show Author Affiliations
Leontios Stampoulidis, Constelex Technology Enablers (Greece)
Konstantinos Vyrsokinos, National Technical Univ. of Athens (Greece)
Christos Stamatiadis, National Technical Univ. of Athens (Greece)
Hercules Avramopoulos, National Technical Univ. of Athens (Greece)
Lars Zimmermann, Technische Univ. Berlin (Germany)
IHP GmbH (Germany)
Karsten Voigt, Technische Univ. Berlin (Germany)
Zhen Sheng, Univ. Gent (Belgium)
Dries Van Thourhout, Univ. Gent (Belgium)
Jochen Kreissl, Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut (Germany)
Ludwig Mörl, Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut (Germany)
Jens Bolten, AMO GmbH (Germany)
Thorsten Wahlbrink, AMO GmbH (Germany)
Fausto Gomez-Agis, Technische Univ. Eindhoven (Netherlands)
Eduward Tangdiongga, Technische Univ. Eindhoven (Netherlands)
Harmen J. S. Dorren, Technische Univ. Eindhoven (Netherlands)
Annachiara Pagano, Telecom Italia (Italy)
Emilio Riccardi, Telecom Italia (Italy)


Published in SPIE Proceedings Vol. 7719:
Silicon Photonics and Photonic Integrated Circuits II
Giancarlo Cesare Righini, Editor(s)

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