Share Email Print

Proceedings Paper

Low cost, high performance far infrared microbolometer
Author(s): Audun Roer; Adriana Lapadatu; Anders Elfving; Gjermund Kittilsland; Erling Hohler
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Far infrared (FIR) is becoming more widely accepted within the automotive industry as a powerful sensor to detect Vulnerable Road Users like pedestrians and bicyclist as well as animals. The main focus of FIR system development lies in reducing the cost of their components, and this will involve optimizing all aspects of the system. Decreased pixel size, improved 3D process integration technologies and improved manufacturing yields will produce the necessary cost reduction on the sensor to enable high market penetration. The improved 3D process integration allows a higher fill factor and improved transmission/absorption properties. Together with the high Thermal Coefficient of Resistance (TCR) and low 1/f noise properties provided by monocrystalline silicon germanium SiGe thermistor material, they lead to bolometer performances beyond those of existing devices. The thermistor material is deposited and optimized on an IR wafer separated from the read-out integrated circuit (ROIC) wafer. The IR wafer is transferred to the ROIC using CMOS compatible processes and materials, utilizing a low temperature wafer bonding process. Long term vacuum sealing obtained by wafer scale packaging enables further cost reductions and improved quality. The approach allows independent optimization of ROIC and thermistor material processing and is compatible with existing MEMS-foundries, allowing fast time to market.

Paper Details

Date Published: 13 May 2010
PDF: 9 pages
Proc. SPIE 7726, Optical Sensing and Detection, 77260Z (13 May 2010); doi: 10.1117/12.855784
Show Author Affiliations
Audun Roer, Sensonor Technologies AS (Norway)
Adriana Lapadatu, Sensonor Technologies AS (Norway)
Anders Elfving, Sensonor Technologies AS (Norway)
Gjermund Kittilsland, Sensonor Technologies AS (Norway)
Erling Hohler, Sensonor Technologies AS (Norway)

Published in SPIE Proceedings Vol. 7726:
Optical Sensing and Detection
Francis Berghmans; Anna Grazia Mignani; Chris A. van Hoof, Editor(s)

© SPIE. Terms of Use
Back to Top