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Proceedings Paper

Scatterometric analysis of chatter marks occurring in industrial grinding processes
Author(s): J. Böhm; A. Vernes; M. Jech; M. Vellekoop
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Paper Abstract

Grinding processes often underlie chattering which results in a wavy surface of the ground metal sheet. In this work it will be shown that the angle resolved light scattering method is not only suitable to monitor industrial grinding processes, in both waviness and roughness modes, but also enables the determination of the waviness of a ground surface. Furthermore it is demonstrated that the roughness, e.g. the average roughness Ra and roughness depth Rz, of a ground surface directly depends on the grinding pressure. The light scattering value Aq correlates with the roughness values obtained with a stylus probe system. In this way it is proven that the light scattering system unambiguously determines chatter marks and the roughness of a metal sheet during a grinding process.

Paper Details

Date Published: 14 May 2010
PDF: 7 pages
Proc. SPIE 7718, Optical Micro- and Nanometrology III, 77181E (14 May 2010); doi: 10.1117/12.854419
Show Author Affiliations
J. Böhm, Austrian Ctr. of Competence for Tribology (Austria)
A. Vernes, Austrian Ctr. of Competence for Tribology (Austria)
Technische Univ. Wien (Austria)
M. Jech, Austrian Ctr. of Competence for Tribology (Austria)
M. Vellekoop, Technische Univ. Wien (Austria)


Published in SPIE Proceedings Vol. 7718:
Optical Micro- and Nanometrology III
Christophe Gorecki; Anand Krishna Asundi; Wolfgang Osten, Editor(s)

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